Xinxunwei Technology Co., Ltd - Shenzhen, China


Solder Type:Lead Solder/Lead Free SMD Type:Micro BGA,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:W50*D50mm~W440*D310mm Heating Mode/Power(Upper):Hot-blast Air / 800W Heating Mode/Power(Bottom):Hot-blast ...Read More





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Solder Type:Leaded Solder / Lead Free SMD Type:Micro Bga,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:W50mm*D50mm~W455*D350mm Heating Mode/Power (Upper):Hot-blast Air /800W Heating Mode/Power (Bottom):Hot-blast Air /800W Preheating Mode/Power:I ...Read More





 385

Solder Type:Lead/Lead Free SMD Type:Micro Bga,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:W50*D50~W455*D350mm Heating Mode/Power(Upper):Hot-blast Air /800W Heating Mode/Power(Bottom):Hot-blast Air /800W Preheating Mode/Power:IR 2400W PCB Loca ...Read More





 423

Solder Type:Leaded/Lead Free SMD Type:Micro BGA,BGA,CSP,QFP PCB Thickness:0.5~4mm PCB Size:W50*D50~W440*D310mm Heating Mode/Power(Upper):Hot-blast Air /800W Heating Mode/Power(Bottom):Hot-blast Air /800W Preheating Mode/Power:IR /2200W PCB Loc ...Read More





 443

Solder Type:Leaded Solder/Lead Free Suitable SMD Type:Micro Bga,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:415mm*325mm --- 80mm*80mm Heating Mode/Power(Upper):Hot-blast Air /650W Heating Mode/Power(Bottom):Hot-blast Air /650W Preheating Mode ...Read More





 412

Solder Type:Leaded Solder /Lead Free SMD Type:Micro Bga,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:W50mm*D50mm~W455mm*D350mm Heating Mode /Power(Upper):Hot-blast Air /800W Heating Mode /Power(Bottom):Hot-blast Air /800W Preheating Mode/Power: ...Read More





 434

Solder Type:Leaded Solder/Lead Free SMD Type:Micro BGA,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:415mm*325mm - 80mm*80mm Heating Mode /Power (Upper):Hot-blast Air /650W Heating Mode/Power(Bottom):Hot-blast Air /650W Preheating Mode/ Power:I ...Read More





 407

Solder Type:Leaded Solder/Lead Free SMD Type:Micro Bga,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:W50mm*D50mm~W455mm*D350mm Heating Mode/Power(Upper):Hot-blast Air /800W Heating Mode/Power(Bottom):Hot-blast Air /800W Preheating Mode/Power:IR ...Read More





 403

Power Supply:AC 220V/50-60HZ Heating Method:Two-side Infrared Heating Demension:Lmm360*Wmm520*H430mm Maximum Power:2.3KW PCB Size:405mm*310mm Upper Heating Control Method:High-precision Closed-loop Control, Instrument Error Is About 0.5% Upper ...Read More





 345

Solder Type:Leaded Solder/Lead Free SMD Type:Micro BGA,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:80mm*80mm 415mm*325mm Heating Mode/Power(upper):Hot-blast Air /650W Heating Mode/Power(bottom):Hot-blast Air /650W Preheating Mode/Power:IR / ...Read More





 430

0.25mm*25W Pcs BGA Solder Ball Standard Package By Manfacturer Leaded Composition 0.250mm Leaded Solder Ball Brand: Taiwan Entai Producing AreaTaiwan Component: Sn63/Pb37 Solder Ball Diameter: 0.250mm Package: Antistatic Material, 25Wp ...Read More





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0.30mm*25W Pcs BGA Solder Ball Standard Package By Manfacturer Leaded Composition 0.300mm Leaded Solder Ball Brand: Taiwan Entai Producing AreaTaiwan Component: Sn63/Pb37 Solder Ball Diameter: 0.300mm Package: Antistatic Material, 25Wp ...Read More





 118

Solder Type:Leaded Solder/Lead Free SMD Type:Micro Bga,BGA,CSP,QFP PCB Thickness:0.5mm~4mm PCB Size:W50mm*D50mm~W455mm*D350mm Heating Mode/Power(Upper):Hot-blast Air /800W Heating Mode/Power(Bottom):Hot-blast Air /800W Preheating Mode/Power:IR ...Read More





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CF260 Working Parameter: Model CHINAFIX CF260 Solder Type Lead Solder/Lead Free SMD Type Micro BGA,BGA,CSP,QFP PCB Thickness 0.5mm~4mm PCB Size W50*D50mm~W440*D310mm Heating Mode/Power(Upper) Hot-blast Air / 800W ...Read More





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