Place of Origin : Shenzhen,China
Post Date : 29-04-2014
Expiry Date : 31-12-2014

Solder Type:Leaded Solder / Lead Free
SMD Type:Micro Bga,BGA,CSP,QFP
PCB Thickness:0.5mm~4mm
PCB Size:W50mm*D50mm~W455*D350mm
Heating Mode/Power (Upper):Hot-blast Air /800W
Heating Mode/Power (Bottom):Hot-blast Air /800W
Preheating Mode/Power:IR / 2400W
PCB Location Mode:Shape Or Tongs
Drive Mode:Gear,Rack
Control / Adjusting Mode:Temperature Control Instrument
Temperature Range:Room Temperature 0~400
Max Power:4000W
Supply Volt:110V/220V
Machine Dimension:760mm(L)*700mm(W)*600mm(H)
Weight:36KG
CF360 Characteristic:
1, The Hot-air Part Adopts Exported Long-life Heating Coil, Through Special Insulation Heating Treatment, Heating Uniformlier, Long-life To Use Well.
2, The Design Of Three Warm Areas Support, Can Fine Adjust To Support Height, Avoid Welding-area To Sink.
3. The Upper Hot Air-flow Can Be Adjusted, Use Different Air-flow To Different Chips, It's Not Easy To Make Expand.