Place of Origin : Shenzhen,China
Post Date : 29-04-2014
Expiry Date : 31-12-2014

Solder Type:Leaded Solder/Lead Free
SMD Type:Micro BGA,BGA,CSP,QFP
PCB Thickness:0.5mm~4mm
PCB Size:415mm*325mm - 80mm*80mm
Heating Mode /Power (Upper):Hot-blast Air /650W
Heating Mode/Power(Bottom):Hot-blast Air /650W
Preheating Mode/ Power:IR/ 700W
PCB Location Mode:Shape Or Tongs
Driving Mode:Driving By Stepping Motor
Control Mode:Temperature Control Instrument
Temperature Range:Room Temperature ~400
Main Power:2000W
Supply Voltage :110V/220V
Machine Dimension:530mm(L)*385mm(W)*500mm(H)
Machine Weight:18KG

Machine Characteristic
1. Hot Air Parts Adopt Exported Ceramics Heating Chips Which Heats Uniformly And Wears Well.
2. The Support Design Of Three Heating Area,fine Turning To Support, In Case Of Welding Area To Sink
3. Upper & Bottom Hot Air Control Temperature Independently, It Can Store 10 Groups And 16 Stages Temperature Curve.