Place of Origin : Shenzhen,China
Post Date : 29-04-2014
Expiry Date : 31-12-2014

Solder Type:Leaded Solder/Lead Free
SMD Type:Micro Bga,BGA,CSP,QFP
PCB Thickness:0.5mm~4mm
PCB Size:W50mm*D50mm~W455mm*D350mm
Heating Mode/Power(Upper):Hot-blast Air /800W
Heating Mode/Power(Bottom):Hot-blast Air /800W
Preheating Mode/Power:IR /2400w
PCB Location Mode:Shape Or Tongs
Driving Mode:Gear,rack
Control/Adjusting Mode:Touch Screen + PLC
Temperature Range:Room Temperature 0~400
Max Power:4000W
Supply Voltage:110V/220V
Machine Dimension:610mm(L) * 550mm(W) * 600mm(H)
Weight:28KG

CF350T Characteristic:
1, The Hot-air Part Adopts Exported Long-life Heating Coil, Through Special Insulation Heating Treatment, Heating Uniformlier, Long-life To Use Well.
2, The Design Of Three Warm Area Support, Can Fine Adjust To Support Height, Avoid Welding-area To Sink.
3. The Upper Hot Air-flow Can Be Adjusted, Use Different Air-flow To Different Chips, Preciser Temperature, It's Not Easy To Make Expand.