1) RO4350B and RO4003C RO4350B 4mil(0.1mm) 10mil(0.254mm) 13.3mil(0.338mm) 20mil (0.508mm) 30mil(0.762mm) 60mil(1.524mm) RO4003C ...Explore More
1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6 ...Explore More
1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend ...Explore More
1). Size: 72*90mm/1 up 2). Layer count: 4 Layer, 20 μm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 μm 5). SMOBC: L ...Explore More
1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill ...Explore More
1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 μm copper finished 4). LPI Green solder mask/ white legend 5). Imme ...Explore More
1) L1 and L4, track /space(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, track /space(mil) 6.1/7.8, precision +/-1 ...Explore More
1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Lalyer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, ...Explore More
1) 160*160mm, S1600 FR-4 CTI ≥ 600V, 2) 8 layer 3) Finished inner/outer: 35 μm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 t ...Explore More
1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4m ...Explore More
