* FR-4, High TG170, High CTI 600V * MCPCB, 1W/mk- 3W/mk * High Speed Material (RO4350B, RO4003C Etc) * MCPCB Double Sided * Rogers Multi-layer PCB * Quick Turn Around (QTA) Prototypes * Double Sided And Multi-layer PCB * Prototypes, Small Volu ...Read More

Mix High Frequency Material (basic Stack Up): | --- ---------- LAYER 1 (TOP LAYER) 0.5OZ+PLATE | Pre-Preg 10MIL RO4350B | ---------- LAYER 2 (MID LAYER 1) 0.5OZ 1.6 Mm +/-10% Core FR ...Read More

Technical Parameters: *NPTH And PTH( 20 Um) *Thermal Stress: 288C/10sec *Permitivity: ER2.1-10.0 *Base Copper: 0.5oz, 1oz *Together With FR-4 Combination *Rogers Multilayer PCB *Immersion Gold ...Read More

Material Available *FR-4 Normal TG *FR-4 TG170 *FR-4 High CTI>600V *RO4350B *RO4003C Dielectric Material & Stack Up Requirement FR-4(no Copper): 0.05-3.2mm For Option Prepr ...Read More

MATERIAL BRAND ITEQ: IT-180ATC Laminate, IT-180ABS Prepreg SHENGYI: S1170 Laminate, S0701 Prepreg ROGERS: RO4350B, RO4003C APPLICATIONS Multilayer And High Layer, Heavy Copper Applications, Computer And Periphe ...Read More

Technical Parameters *Controlled Dielectric *Controlled Impedance *Design Coupons *Test Coupons *Polar CITS500 *Tolerance +/-10% *Differential Impedance *Single End Impedance ...Read More