This is the product title

Blind via PCB - Product


Place of Origin : Shenzhen,China

Product Description

1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias.
2). FR-4 Material, 1 oz weight.
3). 8 layer, 1.6mm thick.
4). 4/4 mils track and space
5). Min.drill 0.1mm
6). Green solder mask/ white silkscreen
7). Immersion gold over nickel

Physical Specification

Other Specification : 1). 1+C+1 HDI, Buried/blind L1-L5/L5-L8 Vias. 2). FR-4 Material, 1 Oz Weight. 3). 8 Layer, 1.6mm Thick. 4). 4/4 Mils Track And Space 5). Min.drill 0.1mm 6). Green Solder Mask/ White Silkscreen 7). Immersion Gold Over Nickel

Company Inforamtion
Bicheng Enterprise Company
[ Manufacturer - China ]
 : 3-203 Shidai Jingyuan, Fuyong, Baoan, Shenzhen City, Guangdong, China
 :  86 755 27374946
 : info@bicheng-enterprise.com
 :  www.bicheng-enterprise.com

 : Kevin Liao
 :  86 755 27374946
 : info@bicheng-enterprise.com
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