The TIC808Y Series is low melting point thermal interface material. At 50, The TIC800Y Series begins to soften and flow, filling the microscopic irr ... Explore More
The TIC810Y Series is low melting point thermal interface material. At 50, The TIC810Y Series begins to soften and flow, filling the microscopic irr ... Explore More
TIS580-13 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and ad ... Explore More
