Dongguan Ziitek Electronic Materials Technology limited - Dongguan, China


TIS580-13 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and ad ...
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 119

The TIC810Y Series is low melting point thermal interface material. At 50, The TIC810Y Series begins to soften and flow, filling the microscopic irr ...
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 144

The TIC808Y Series is low melting point thermal interface material. At 50, The TIC800Y Series begins to soften and flow, filling the microscopic irr ...
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 131