Computer Serves Thermal Phase Changing Materials / Heat Sensitive Materials - Product

Other Specification :  The TIC808Y Series Is Low Melting Point Thermal Interface Material. At 50, The TIC800Y Series Begins To Soften And Flow, Filling The Microscopic Irregularities Of Both The Thermal Solution And The Integrated Circuit Package Surface, Thereby Reducing Thermal Resistance.The TIC800Y Series Is A Flexible Solid At Room Temperature And Freestanding Without Reinforcing Components That Reduce Thermal Performance. The TIC808Y Series Shows No Thermal Performance Degradation After 1,000 [hours@130,or] After 500 Cycles, From -25 To 125.The Material Softens And Does Not Fully Change State Resulting In Minimal Migration (pump Out)at Operating Temperatures. Features >0.024-in /W Thermal Resistance >Naturally Tacky At Room Temperature, No Adhesive Required >No Heat Sink Preheating Required Applications - - - - High Frequency Microprocessors | Notebook | Computer Serves | Memory Modules | Cache Chips | IGBTs | COB Led | Desktop PCs | CPU | Microprocessors | Chipsets | Graphic Processing Chips | Custom ASICs | Servers | Memory Modules | Power Semiconductors | Power Conversion Modules | LED Power Supply | LED Controller | LED Lights | LED Ceilinglamp | Monitoring The Power Box | AD-DC Power Adapters | - - - - - - - - Typical Properties Of TIC800Y Series | Product Name | TICTM803Y | TICTM805Y | TICTM808Y | TICTM810Y | Testing Standards | Color | Yellow | Yellow | Yellow | Yellow | Visual | Composite Thickness | 0.003" (0.076mm) | 0.005" (0.126mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | | Thickness Tolerance | 0.0006" (0.016mm) | 0.0008" (0.019mm) | 0.0008" (0.019mm) | 0.0012" (0.030mm) | | Density | 2.2g/cc | Helium Pycnometer | Work Temperature | -25125 | | Phase Transition Te

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