Cu Base Copper-Clad Laminate - Product
MINIMUM QUANTITY
100 SQ.M
Place of Origin : Huizhou,China
Delivery Time : 3 Or 7 Days For Ready Goods
Payment Terms : D/P D/A L/C T/T
Product Description
Copper Base Copper Clad Laminate products consist of Copper Base Board, using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed.
Basic Information
Brand : GREENMARK
Model : AL-H-06
Material : Cu
Physical Specification
Other Specification : Specification:
CCL Thickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm
Thermal Conductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k
Dielectric Thickness:80um-150um
Copper Foil: 1OZ,2OZ,3OZ
Supply Size:500*600mm/400*1200mm/500*1200mm/600*1200mm,We Can Supply Other Size Upon Request.
Item No. : Cu-H-06
