Aluminum Copper Clad Laminate - Product
MINIMUM QUANTITY
100 SQ.M
Place of Origin : Huizhou,China
Delivery Time : 3 Or 7 Days For Ready Goods
Payment Terms : D/P D/A L/C T/T
Product Description
Aluminum Base Copper Clad Laminate products consist of Aluminum Base Board, using thermal conductivity resin on the Al base surface,single side Copper Foil, and after hot-pressing process formed.
Basic Information
Model : AL-H-06
Material : Aluminum,Prepreg,Copper Foil
Physical Specification
Other Specification : Specification:
CCL Thickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm
Thermal Conductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k
Dielectric Thickness:80um-150um
Copper Foil:1OZ,2OZ,3OZ
Supply Size:500*600mm/400*1200mm/500*1200mm/600*1200mm,We Can Supply Other Size Upon Request.
Item No. : AL-H-06
Feature:
Meet The RoHS Requirements
Excellent Thermal Conductivity
Solder Excellent Performance
Outstanding Reliability
Good Machinability
Excellent Dimensional Stability
Electromagnetic Wave Shielding
Application:
Copper Clad Laminate Is The Electronic Industrial Base Material, Mainly Used For The Manufacture Of Printed Circuit Board (PCB), Widely Applied In Television, Radio, Computer, Mobile Communications And Other Electronic Products.
