Addition Cure Silicone for Potting & Encapsulation - Product

Other Specification : Description Of Addition Cure Silicone For Potting & Encapsulation RTV160 Is A Two-component Room Temperature Cure Potting Compound With Mix Ratio Of 1: 1, Curing Time Can Be Accelerated By Heating Up, Features With Good Flow Ability And Flame Resistance. It's Suitable For Encapsulating Of LED Displayers, Power Module And Electronics Components, Etc. Features Of Addition Cure Silicone For Potting & Encapsulation Easy Mix With 1: 1 Proportion Low Viscosity, Good Flow Ability Room Temperature Cure Or Heat Up Cure Thermal Conduction, Flame Resistance Without Solvent Using Instructions Of Addition Cure Silicone For Potting & Encapsulation 1. Preparing: Clean Up The Coating Surface, Remove The Rust, Dust, Oil Dirt. 2. Pouring: Weigh The Silicone And Catalyst Correctly, Mix Silicone Part A And Part B Thoroughly, Pour Onto The Electronic Components/surface After Vacuum Degassing. 3. Curing: Room Temperature Cure Or Heat-up Cure Is Both Workable. 4. It Should Be Use Up After Open The Package, The Material Must Be Kept In A Cool Place Sealed Well, And It Should Avoid From Contact With Moisture In The Air. Technical Datasheet Of Addition Cure Silicone For Potting & Encapsulation Item No. RTV 160 ColorGrey Viscosity MPa. S 25C3000~6000 Density G/cm31.57± 0.02 Pot Life Min 25C30 Curing Time H24 Curing Time With Heat Min 100C10 Hardness Shore A55~60 Dielectric Strength Kv/mm 25C≥ 20 Volume Resistivity DC500V Ω Cm3× 1015 Tensile Strength Mpa≥ 0.6 Thermal Conductivity W/m0.58 Temperature C-30~200 Note: Mechanical And Electrical Performance Data Tested At 25° C 7 Days After Curing, Relative Humidity Of 55%; All The Tested Data Is Average Value. Packaging Of Potting & Encapsulation Compound Silicone Packs Are Available In 20kg And 200kg Per Drum. Storage & Transportation Of Addition Cure Silicone For Potting & Encapsulation 1. Keep It From Strong Sunshine, Heat, And Stor

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