Head Electronic co.,ltd - Dongguan, China

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Project Description | Parameters 2 Layer Thickness: 1.6+/-0.16 Mm Min Hole Size: 0.3 Mm Width/Space: 0.15mm/0.12 Mm Surface Treatment: ENIG | Craft Normal 2 Layer Board | Application Consumer Electronics Read More





 917

Project Description | Parameters 10 Layer Thickness: 1.6+/-0.16 Mm Min Hole Size: 0.15 Mm Width/Space: 0.12mm/0.1 Mm Surface Treatment: ENIG+Gold Finger | Craft Red Ink Gold Finger | Application Industrila Control Read More





 268

Project Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 Mm Min Hole Size: 0.3 Mm Width/Space: 0.15mm/0.12 Mm Surface Treatment: ENIG | Craft Black Ink Rigid-Flex Board | Application Consumer Electronics Read More





 275

Layer: 1L Material: Aluminum Board Thickness: 1.6mm Surface Technique: ImmersionGold Minimum Hole Size: 0.6mm Application Field: LED, Automobile Read More





 1,079

Project Description | Parameters 10 Layer (3 Stage) Thickness: 1.6+/-0.16 Mm Min Hole Size: Via: 0.25 Mm Blind Via: 0.15mm Width/Space: 0.1mm/0.08 Mm Surface Treatment: ENIG | Craft 3 Stage HDI | Application Indu ...Read More





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