Place of Origin : Huizhou,China
Post Date : 22-05-2011
Expiry Date : 22-06-2011

FPC Capability:
No. Of Layer: 1-8
Large Size Of Circuit: 250.00X400.00
Board Thinckness: 0.085-0.4mm
Hole Diameters: 0.25mm-6.50mm
Base Copper Wt.: 12um-70um
PI Thickness: 12.5-50um
Stiffener: PI, PET, FR4 And Metal
Au Thickness Of Plating Gold: ≥ 0.05μm
Au Thickness Of ENIG: 0.05um-0.1um
Outline Tolerance: ± 0.1mm
Surface Treatment: ENIG, HAL, Gold Plating Immersion Tin Etc.
Packing & Delivery
Packing: Vacuum Packing, Export Carton
Delivery: 3-12days.FOBshenzhen