HOT AIR SOLDER LEVELING HASL PCB - [ Sell Product ]

Place of Origin : Changsha,China
Post Date : 24-08-2020
Expiry Date : 08-07-2026

Trade Description

Hot Air Solder Leveling Of Hasl Pcb, Which Is A Process Of Coating Molten Tin-lead Solder On The Surface Of The PCB And Leveling (blow-out) With Heated Compressed Air To Form A Coating Layer That Is Resistant To Copper Oxidation And Provides Good Solderability.
Hot Air Leveling Is Divided Into Two Types: Vertical And Horizontal. Generally, The Horizontal Type Is Considered To Be Better. The Horizontal Hot Air Leveling Coating Is Relatively Uniform, Which Can Realize Automatic Production. The General Process Is: Micro-etching-> Preheating-> Coating Flux-> Spraying Tin-> Cleaning.

HASL PCB
Currently, About 25% -30% Of PCBs Use The Hot Air Leveling Process. Hot Air Leveling Is A Dirty, Unpleasant, And Dangerous Process, So It Has Never Been A Favorite Process, But Hot Air Leveling Is An Excellent Process For Larger Components And Larger Spacing Wires. In High-density PCBs, The Flatness Of Hot Air Leveling Will Affect Subsequent Assembly; Therefore, HDI Boards Generally Do Not Use The Hot Air Leveling Process.

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