Place of Origin : Dongguan,China
Post Date : 18-04-2012
Expiry Date : 18-05-2012

2.0m Immersion Tin FR4 Rigid Multilayer Printed Circuit Board 10 Layers


Material: FR4

Surface Treatment: Immersion Tin

Width/space: 3.5/3.5mil
Finish Thickness: 2.0m

Min Hot:0.25mm

 

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SPECIFICATION |
Materials | Polyimide | Polyester ( PET) | Remark& |
(Kapton) | Test Method |
  | 　 | 1~8(Rigid-Flex & Multilayers  FPC) | 1~2 | 　 |
  | Single Sided | 0.050 Mm | 　 |
  | Double Sided | 0.075 Mm | 　 |
  | Drilling P.T.H. | 0.2 Mm | 　 |
  | Punching | 1.0 Mm | 　 |
  | Conductor Width (W) | 0.025 Mm | W0.5mm |
  | Hole Diameter (H) | 0.05 Mm (withP.T.H.0.1mm) | H1.5mm |
  | Accumulated Pitch (P) | 0.05 Mm (Special0.03mm) | P25mm |
  | Outline Dimension (L) | 0.05 Mm | L50 Mm |
  | Conductors And Outline (C) | 0.15 Mm (Special 0.07mm) | C5.0 Mm |
  | Conductors And Coverlay | 0.3~0.5 Mm  | 　 |
Surface Treatment On | Soft Or Hard Ni/Au Sn/Pb (2~60μm) Primary FluxCarbon Printed 4~10μm Silver Gel Printed | 　 |
Terminals And Land Areas |
Insulation Resistance | 1000MW | IPC-TM-650  2.6.3.2  |
At Ambient |
Dielectric Strength | 5KV | IPC-TM-650  2.5.6.1 |
Surface Resistance (W) | 5x012 | 2x015 | IPC-TM-650  2.5.17 |
Volume Resistivity (W-cm) | 1x015 | 1x015 | IPC-TM-650  2.5.17 |
Dielectric Constant (1 MHz) | 4 | 3.4 | IPC-TM-650  2.5.5.3 |
Dissipation Factor (1 MHz) | 0.04 | 0.02 | IPC-TM-650  2.5.5.3 |
Peeling Strength (180 Irection) | 1.2kgf/cm | 1.2kgf/cm | IPC-TM-650  2.4.9 |
Solder Heat Resistance | 260 .C/10secs | 210 .C/3secs |
Flammability | 94 V-0 | 94VTM-0 | UL94 |
Water Absorption | 2.90% | 1.00% | ASTM D570% |
(24 Hours) |
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