Place of Origin : Foshan,China
Post Date : 02-07-2010
Expiry Date : 02-09-2011

Electroplating Chemical Copper Clad Aluminum Wire Technology Is A New Technology, Which Can Form A Copper Layer Coverage The Aluminum, And The Product Will Possess The Electrical Conductivity. The Copper Clad Aluminum Wire Will Have The Same Function Compare With Pure Copper, And It's Very Economic. Furthermore, Our Product Is Especially Welcome By Middle East Market.
Once You Buy Our Product, We Will Offer The Technology For Free.
Now, I Take The Comparison As Follow:
Name Volume Ratio% Mass Ratio% The Length Ratio Compare With Copper Wire Density(g/cm3) Resistance Conductivity
CCA10% 8--13 27 2.65:1 3.32 0.02743 63
CCA15% 13--17 37 2.45:1 3.63 0.02676 65
CU 100 100 1:1 8.89 0.01724 100
Furthermore, Our Products Are Welcomed To South Asia, Middle East, South Africa And Ect. Market.
If You Have Something Troblem On Copper, Aluminum, Alloy And Other Metal, Please Connect With Me, And I Will Do My Best To Help You.