Place of Origin : Shenzhen,China
Automatic Wafer Cleaning Device After Light Resistance
Automatic Wafer Cleaning Device After Light Resistance
Product Description
Application Field: Removal Of Photoresistance/wafer Cleaning After Grinding
Wafer Size: 150mm&200mm&300mm (customizable)
Process Indicators: Wafers With Processes Above 19nm Can Be Cleaned
Automatic Wafer Plating Machine Features:
Equipped With 2 Or 3 Load Ports
Industrial Control Machine Touch Screen Operation Control, Convenient And Fast
Use Genuine Industrial Iot Configuration Software For Control And Monitoring
Support SECS/GEM Communication Protocol And Data Transmission
Horizontal Chamber, No Cross Contamination
Equipped With Two-arm Wafer Handling Manipulator Imported From Japan, Efficient And Stable
Equipped With Up To 8 Cleaning Chambers (customized)
Cleaning Liquid Independent Control, No Cross Contamination
Equipped With Nozzle Liquid Flow Accurate Control System
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