Taiwan Entai 0.30mm*25Wpcs BGA Solder ball leaded - Product

Brand : Entai
Model : 0.30mm
Expiry/Validation Period : 1 Year

Other Specification : 0.30mm*25W Pcs BGA Solder Ball Standard Package By Manfacturer Leaded Composition 0.300mm Leaded Solder Ball Brand: Taiwan Entai Producing AreaTaiwan Component: Sn63/Pb37 Solder Ball Diameter: 0.300mm Package: Antistatic Material, 25Wpcs/bottle Entai Sicence And Technology CO.,Ltd Is One Of The Solder Ball Manufacturers Authenticated By TS 16949. Solder Ball's Diameter Can Be 75um, There Is A Few Manufacturers Which Can Make That Craft. Sphere Diameter's Tolerance Is The Strict, Internally Piloting Tolerance Is Only 8um, Far Lower Than The Standard 10-25um In The Industry. Refining Material Made By Self, Strengthen Solder Ball's Welding Ability, And Increase The Rate Of Welding. Added Microelement Increase Solder's Antioxidant Ability And Reliability. Packing Material Adopts Antistatic Material And Fits ROHS Standard. What Is Solder Ball: Solder Balls Mainly Connect Semiconductor Chip And Line-moldboard Or PCB Board, They Are The Smallest Electronic Component Transmitting Electronic Signal.

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