Place of Origin : Changsha,China
Payment Terms : T/T,Western Union,
SPEEDAPCB has been focusing on the production of various PTH (plated through hole PCB), buried via hole PCB and blind via hole PCB, and HDI PCB prototype.
HDI PCB
This Manufacturing Process Cannot Be Achieved By Bonding The Circuit Boards And Then Drilling. It Is Necessary To Perform The Drilling Operation At The Individual Circuit Layer, Firstly Locally Bond The Inner Layer, Then Perform Plating Treatment, And Finally All The Bonding. Because The Operation Process Is More Laborious Than The Original Vias And Blind Holes, The Price Is Also The Most Expensive. This Manufacturing Process Is Usually Only Used For High-density Circuit Boards, Increasing The Space Utilization Of Other Circuit Layers.
HDI PCB
In The PCB Manufacturing Process, Drilling Is Very Important. The Simple Understanding Of Drilling Is To Drill The Required Via Holes On The Copper Clad Board, Which Has The Function Of Providing Electrical Connections And Fixing Devices. If The Operation Of The Via Is Caused By Incorrect Operation, The Device Cannot Be Fixed On The Circuit Board, Which Will Affect The Use Of The Circuit Board, And The Entire Board Will Be Scrapped. Therefore, The Process Of Drilling Is Very Important.
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