SMT SMD DIP OEM for PCBA Circuit Board, Double Layer Pcb Board Assembly For Insustiral Controller - Product

Other Specification : SMT SMD DIP OEM For PCBA Circuit Board, Double Layer Pcb Board Assembly For Insustiral Controller Our Services For The PCB Assembly # Re-layout For Shortening The Board Size # Bare Pc Board Fabrication # SMT/BGA/DIP Assembly # Full Component Procurement Or The Substitute Components Sourcing # Wire Harness And Cable Assembly # Metal Parts, Rubber Parts And Plastic Parts Including Mold Making # Mechanical, Case And Rubber Molding Assembly # Functional Testing # Repairs And Inspection Of The Sub-finished / Finished Goods Our Capabilities For The PCB Assembly - - - - Stencil Size Range | 736 Mm X 736 Mm | Min. IC Pitch | 0.30 Mm | Max. PCB Size | 410 Mm X 360 Mm | Min. PCB Thickness | 0.35 Mm | Min. Chip Size | 0201 (0.6 Mm X 0.3 Mm) | Max. BGA Size | 74 Mm X 74 Mm | BGA Ball Pitch | 1.00 Mm (Min) / F3.00 Mm (Max) | BGA Ball Diameter | 0.40 Mm (Min) /F1.00 Mm (Max) | QFP Lead Pitch | 0.38 Mm (Min) /F2.54 Mm (Max) | Frequency Of Stencil Cleaning | 1 Time / 5 ~ 10 Pieces | - - - - Our Capabilities For Handling The Bare PC Board Fabrication Fabrication Data Inputs: Gerber Data RS-274-X Or RS-274-D With Aperture List And Drill Files, Design File With Protel, PAD2000, POWERPCB, ORCAD Layers 2-30 L Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers, Isola, Taconic, Arlon, Teflon, Aluminum Based Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm Outline Tolerance 4mil 0.10mm Board Thickness 8mil-236mil / 0.2mm-6.0mm Board Thickness Tolerance 10% Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm Min. Track Width 3mil / 0.075mm Min. Track Space 3mil / 0.075mm External Cu Thickness HOZ-6OZ / 17um~210um Internal Cu Thickness HOZ-6OZ / 17um~210um Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm

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