SMT / BGA / DIP OEM PCB Board Assembly, CEM-3 FR-4 Single Layer ElectronicPCB Assembly - Product
Place of Origin : Shenzhen,China
Delivery Time : 4weeks - 8 Weeks
Product Description
SMT / BGA / DIP OEM PCB Board Assembly, CEM-3 FR-4 Single Layer Electronic PCB Assembly
Key Specifications/Special Features:
Taking IPC-A-160 standard which is the most widely recognized standard of electronic assemblies
Complicated boards and components available
Provides OEM services to all sorts of printed circuit board assemblies as well as electronic encased products
We provide the real vertically integrated OEM service form procurement, plastic tooling/injection,
Physical Specification
Other Specification : SMT / BGA / DIP OEM PCB Board Assembly, CEM-3 FR-4 Single Layer Electronic PCB Assembly
Key Specifications/Special Features:
Taking IPC-A-160 Standard Which Is The Most Widely Recognized Standard Of Electronic Assemblies
Complicated Boards And Components Available
Provides OEM Services To All Sorts Of Printed Circuit Board Assemblies As Well As Electronic Encased Products
We Provide The Real Vertically Integrated OEM Service Form Procurement, Plastic Tooling/injection,
Can Place 0201 SMD Chip , BGA And X-ray ,AOI Inspection
PCB Assembly, Final Casing Assembly/testing, Quality Assurance To Shipping
In-circuit Testing Capability For PCBAs
PCBA/SMT/final Assembly -vertical Integrated Manufacturing Solution
Profound Knowledge Of Contract Manufacturing Services
Capable Of Developing Effective Production Process To Ensure High Quality And Consistency
Experienced Logistic Control
Cost-effective Factory Located In China
Flexible Production For Customers' Required Volumes
Reliable Circuit Board Available In Soldering And Casing Assembly
The Overall Quality Of Assembled Product Is Guaranteed By The Quality Of The Components Made
Reliable Contract Assembly Service Provides Optimal Flexibility
Our Services For The PCB Assembly
# Re-layout For Shortening The Board Size
# Bare Pc Board Fabrication
# SMT/BGA/DIP Assembly
# Full Component Procurement Or The Substitute Components Sourcing
# Wire Harness And Cable Assembly
# Metal Parts, Rubber Parts And Plastic Parts Including Mold Making
# Mechanical, Case And Rubber Molding Assembly
# Functional Testing
# Repairs And Inspection Of The Sub-finished / Finished Goods
Our Capabilities For The PCB Assembly
- - - -
Stencil Size Range | 736 Mm X 736 Mm |
Min. IC Pitch | 0.30 Mm |
Max. PCB Size | 4